Current Vacancies

Hardware Engineering Intern

硬件实习生

岗位概述

该岗位主要负责PCB设计、线束焊接、内镜装配等硬件开发相关工作，支持多臂手术机器人项目硬件开发工作。

岗位职责

1.协助完成PCB设计，包括原理图设计和PCB布局、布线；

2.进行焊接、调试和硬件维修，确保电路板的正常运行；

3.协助研发团队完成硬件设计文档的编写与归档；

4.配合团队完成其他硬件相关的支持工作。

任职要求

1.电子信息工程、通信工程等相关专业，本科及以上学历，实习期间需保证每周至少3天到岗；

2.熟练使用至少一种PCB设计工具（如Altium Designer、KiCAD、OrCAD等）；具备较强的动手能力和学习能力，良好的团队合作与沟通能力。

申请方式

请将个人简历发送至hr02@cair-cas.org.hk。邮件主题请注明应聘[岗位名称]-[姓名]-[官网投递]。

Position Overview

This position is responsible for hardware development related work such as PCB design, wiring harness soldering, endoscope assembly, etc., to support the hardware development of the Multi-Arm Surgical Robot project.

Job Responsibilities

1.Assist in PCB design, including schematic design and PCB layout and wiring;

2.Perform soldering, debugging and hardware maintenance to ensure the normal operation of the board;

3.Assist the R&D team to complete the hardware design documentation and archiving;

4.Cooperate with the team to complete other hardware-related support work.

Job Requirements

1.Electronic information engineering, communication engineering and other related majors, bachelor degree or above, during the internship need to ensure that at least 3 days a week to work;

2.Skilled in using at least one PCB design tool (such as Altium Designer, KiCAD, OrCAD, etc.); Strong hands-on ability and learning ability, good teamwork and communication skills.

Application Method

Please send your resume to hr02@cair-cas.org.hk. For the email subject line, please indicate: Application for [Position Name] - [Name] - [Applied via CAIR Official Website].