Hardware Engineering Intern
Hardware Engineering Intern
硬件工程实习生
岗位概述
通过 PCB 设计、内窥镜组装、实验室操作和故障排除,支持医疗设备硬件开发(用于外科手术的灵活辅助机器人系统项目)。
岗位职责
1.设计简单的印刷电路板/迭代(原理图/布局)
2.在测试过程中调试硬件问题
3.协助内窥镜组装和测试
4.跟踪组件并生成设计文档(物料清单/测试报告)
5.高质量地执行支持职责
岗位要求
1.教育背景:电子、自动化或相关专业的学士/硕士学位
2.技能:精通至少一种 EDA 工具(Altium/KiCad/OrCAD)
3.特质:注重细节、积极主动的团队合作者
申请方式
请将简历提交至 [hr02@cair-cas.org.hk],邮件标题为岗位名+姓名。如过往有 PCB/硬件项目,请重点注明。
Role Summary
Support medical device hardware development (Flexible and Assistive Robotic Systems for Surgery project) through PCB design, endoscope assembly, lab operations, and troubleshooting.
Responsibilities
1. Design simple PCBs/iterations (schematics/layout)
2. Debug hardware issues during testing
3. Assist with endoscope assembly and testing
4. Track components and generate design docs (BOMs/test reports)
5. High-quality execution of support duties
Qualifications
1. Education: BS/MS in Electronics, Automation, or related field
2. Skills: Proficient in at least 1 EDA tool (Altium/KiCad/OrCAD)
3. Traits: Detail-oriented, proactive team player
Application Method
Please submit your resume to [hr02@cair-cas.org.hk] with job title + name as the subject of the email. Please highlight previous PCB/hardware projects if any.