Current Vacancies

Current Vacancies

MorphGI team - Embedded Hardware Engineer (Endoscope)


Team and Project Description

团队和项目介绍

MorphGI team in CAIR-HKISI  has developed the world's first disposable, self-propelled and easy-to-operate endoscopic robotic system that incorporates flexible endoscopy, precision control and artificial intelligence. MorphGI can be used for abdominal, upper and lower GI, and duodenal examinations and procedures.

 

The MorphGI team is now recruiting a few engineers, including Software Engineer for System Algorithm Integration and UI, a Mechanical Engineer for Human-machine Interface Design, an Endoscopic Optical Engineer, and an Embedded Hardware Engineer (Endoscope). Interested candidates should send their CVs and relevant materials to hr@cair-cas.org.hk, and the email subject must indicate the name of the position being applied for.

 



Embedded Hardware Engineer (Endoscope)

嵌入式硬件工程师（内窥镜方向）

Job Responsibilities：

  1. Responsible for hardware development of medical endoscope, as well as participate in project demand analysis and risk assessment.
  2. Design the product hardware scheme, complete key device selection and detailed circuit design scheme.
  3. Develop hardware test plans, analyze the test results, and prepare the resolutions of the technical problems.
  4. Follow up the testing, trial production, and resolve the trial production problems if any.
  5. Prepare the technical documents and patents applications.

 

Job Requirements：

  1. Bachelor’s degree or above of Biomedical Engineering, Electronics, Instrumentation, Medical Instruments, or related. At least 3 years’ experience in endoscope development, and familiar with the mainstream endoscope design solutions.
  2. Familiar with various image processing algorithms, such as 3A, gamma correction, color correction, distortion correction, white balance, sharpening, de-fogging, etc.
  3. Proficient in CMOS Sensor selection and application, and familiar with major Sensor suppliers and their products.
  4. Proficient in common image interface, such as MIPI, DVP, DVI, HDMI and DP, and relative convert circuits.
  5. Proficient in FPGA and ARM platform image acquisition and processing system design.
  6. Familiar with the high-speed PCB design, including a deep understanding of DFM, DFT and DFA, and rich experience in hardware welding and debugging.
  7. Familiar with EMC testing and relevant problems solving.
  8. Familiar with products risk analysis methods such as DFMEA and PFMEA (active medical products is preferred). 
  9. Familiar with 3D mechanical structure design (experience in electronic soft mirror research and development is preferred).
  10. Experience in R&D of medical endoscope structure is preferred.
  11. Familiar with OLYMPUS, PENTAX, FUJIFILM, STROZ and other brands of endoscope is preferred.


岗位职责：

  1. 负责医用内窥镜的硬件开发工作，参与项目需求分析及风险评估；
  2. 制定产品硬件系统方案，完成关键器件选型，详细电路设计；
  3. 制订硬件测试方案，分析测试结果并解决具体技术问题；
  4. 跟进项目的测试、试产和转产，解决试产中发现的技术问题并改善；
  5. 产品相关硬件技术文档、专利撰写。

任职要求：

  1. 生物医学工程，电子电气，仪器仪表，医疗器械等相关专业，3年以上内窥镜开发工作经验，熟悉行业主流内窥镜硬件设计方案；
  2. 熟悉多种图像处理算法，例如3A、伽马校正、颜色校正、畸变校正、白平衡，锐化、去雾等；
  3. 精通CMOS Image Sensor选型及应用，熟悉主要CMOS Image Sensor供应商及其产品特性；
  4. 精通MIPI，DVP，DVI，HDMI，DP等图像接口电路，熟悉接口转换设计，了解主流供应商方案；
  5. 精通FPGA及ARM平台图像采集处理方案设计；
  6. 熟悉PCB设计规则，对DFM、DFT、DFA有深入认识，丰富的硬件焊接调试经验；
  7. 熟悉EMC测试，有较丰富相关问题解决经验；
  8. 熟悉DFMEA，PFMEA等风险分析方法；
  9. 熟悉电子或有源医疗产品硬件开发流程，有大型产品量产开发设计经验；
  10. 熟练使用3D机械结构设计软件，有电子软镜研发经验优先；
  11. 具有医疗内窥镜产品结构研发经验者优先，有维修或熟悉奥林巴斯、宾得、富士、开立澳华、卡尔史托斯品牌内窥镜、胃肠镜者优先考虑。


If interested, please send your resume and the position you are applying for to hr02@cair-cas.org.hk



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